Nā noi maʻamau:
Nānā ʻana o ka semiconductor- Nānā ʻana i ka wafer hope, ke ana ʻana o TSV (ma o-silicon ma o), ka loiloi hemahema ma hope o ka dicing laser
Ka nānā ʻana i ka hemahema– Kiʻi ʻana i nā mea luku ʻole ma o nā substrates silicon e nānā i nā hale i kanu ʻia
Ka hana ʻana o ka laser– Nānā manawa maoli o ka ablation laser fiber 1064 nm, ka ʻeli ʻana, a i ʻole ka kuʻi ʻana i ka ʻepekema mea a me ka hana ʻana
ʻEpekema hao a me nā mea hana- Nānā kiʻekiʻe o nā wahi i hoʻopilikia ʻia e ka wela laser, nā papa hana hou, a me nā microstructures
ʻO ka microscopy fluorescence NIR– No nā laʻana olaola a mea paha e pono ai ka hoʻonāukiuki kokoke i ka infrared